Potentially very low manufacturing costs due to solution processing, high efficiency potential (>25% demonstrated), flexible and lightweight form factors, can be semi-transparent for building integration, rapid manufacturing processes using printing techniques, and strong performance in low-light conditions.
Stability issues with degradation in moisture and heat, contains lead which raises environmental concerns, limited commercial availability with no large-scale production, durability questions for 25-year operational lifetime, efficiency drops under real-world conditions, and manufacturing scalability challenges.